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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Aries Electronics
全部重置
应用所有
结果: 4131
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-0513-10H

24-0513-10H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,835 5.96
RFQ
24-0513-10H

Datasheet

0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
19-0518-11H

19-0518-11H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

1,620 5.96
RFQ
19-0518-11H

Datasheet

518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
40-1518-10H

40-1518-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,598 5.96
RFQ
40-1518-10H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-6513-10H

10-6513-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,849 4.02
RFQ
10-6513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
17-0518-00

17-0518-00

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,706 4.07
RFQ
17-0518-00

Datasheet

518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
32-1518-10T

32-1518-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,985 4.07
RFQ
32-1518-10T

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-6518-11

28-6518-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,503 5.51
RFQ
28-6518-11

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-3501-20

14-3501-20

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,909 6.01
RFQ
14-3501-20

Datasheet

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-3501-30

14-3501-30

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

4,494 6.01
RFQ
14-3501-30

Datasheet

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
02-7250-10

02-7250-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

1,745 6.01
RFQ
02-7250-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
Total 4131 Record«Prev1... 7879808182838485...414Next»
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