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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Aries Electronics
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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
27-0518-10

27-0518-10

CONN SOCKET SIP 27POS GOLD

Aries Electronics

2,939 3.20
RFQ
27-0518-10

Datasheet

518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
34-0518-10T

34-0518-10T

CONN SOCKET SIP 34POS GOLD

Aries Electronics

3,676 4.31
RFQ
34-0518-10T

Datasheet

518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-0517-90C

10-0517-90C

CONN SOCKET SIP 10POS GOLD

Aries Electronics

1,996 4.33
RFQ
10-0517-90C

Datasheet

0517 Bulk Active SIP 10 (1 x 10) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
21-0513-10T

21-0513-10T

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,557 3.20
RFQ
21-0513-10T

Datasheet

0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
23-0518-10H

23-0518-10H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

4,784 3.22
RFQ
23-0518-10H

Datasheet

518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
19-0513-10H

19-0513-10H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

1,932 4.36
RFQ
19-0513-10H

Datasheet

0513 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
42-1518-10T

42-1518-10T

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

1,212 4.36
RFQ
42-1518-10T

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-6518-00

24-6518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,441 3.76
RFQ
24-6518-00

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
38-1518-10

38-1518-10

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,265 4.40
RFQ
38-1518-10

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-820-90C

04-820-90C

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

1,105 4.42
RFQ
04-820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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