Welcome to Chuangxin Cloud!

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
30-PRS16018-12

30-PRS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,779 80.41
RFQ
30-PRS16018-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
30-PRS16020-12

30-PRS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,543 80.41
RFQ
30-PRS16020-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
30-PRS16022-12

30-PRS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,377 80.41
RFQ
30-PRS16022-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
108-PLS12005-12

108-PLS12005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,258 81.03
RFQ
108-PLS12005-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
48-3554-16

48-3554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

1,016 81.47
RFQ
48-3554-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6554-16

48-6554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3,608 81.47
RFQ
48-6554-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
209-PGM17020-10H

209-PGM17020-10H

CONN SOCKET PGA GOLD

Aries Electronics

1,990 67.91
RFQ
209-PGM17020-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-PRS15068-12

15-PRS15068-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,669 71.33
RFQ
15-PRS15068-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
80-PRS15072-12

80-PRS15072-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,802 82.76
RFQ
80-PRS15072-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
18-PLS15071-12

18-PLS15071-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,223 71.86
RFQ
18-PLS15071-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
Total 4131 Record«Prev1... 374375376377378379380381...414Next»
One-stop procurement solution
One-stop procurement solution
Cost down and save your time
Cost down and save your time
Reliable package and fast delivery
Reliable package and fast delivery
365 days after-sales service and warranty
365 days after-sales service and warranty
Chuangxin Cloud

HOME

Chuangxin Cloud

PRODUCT

Chuangxin Cloud

E-mail

Chuangxin Cloud

USER