Welcome to Chuangxin Cloud!
Chuangxin CloudUpload BOM Chuangxin CloudMy Account
Chuangxin Cloud Chuangxin Cloud
All Categories
    Language
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    44-536-11

    44-536-11

    CONN SOCKET PLCC ZIF 44POS GOLD

    Aries Electronics

    		 2,589 0.00
    RFQ

    -

    		 536 - Obsolete PLCC, ZIF (ZIP) 44 (4 x 11) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    32-3574-16

    32-3574-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 3,316 40.82
    RFQ
    		32-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-3551-16

    36-3551-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 2,335 65.73
    RFQ
    		36-3551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    1109042

    1109042

    537 ZIF TEST SCKT LIVE BUG TYPE

    Aries Electronics

    		 4,517 66.02
    RFQ
    		1109042

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    281-PGM18037-11

    281-PGM18037-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,593 55.55
    RFQ
    		281-PGM18037-11

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6551-16

    32-6551-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 3,573 58.38
    RFQ
    		32-6551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6572-16

    36-6572-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 4,530 48.83
    RFQ
    		36-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6556-41

    48-6556-41

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 4,768 68.44
    RFQ
    		48-6556-41

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    40-6554-16

    40-6554-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,991 68.99
    RFQ
    		40-6554-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3553-16

    40-3553-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 3,780 68.99
    RFQ
    		40-3553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 4131 Record«Prev1... 365366367368369370371372...414Next»
    One-stop procurement solution
    One-stop procurement solution
    Cost down and save your time
    Cost down and save your time
    Reliable package and fast delivery
    Reliable package and fast delivery
    365 days after-sales service and warranty
    365 days after-sales service and warranty
    Chuangxin Cloud

    HOME

     Chuangxin Cloud

    PRODUCT

     Chuangxin Cloud

    E-mail

     Chuangxin Cloud

    USER
    Chuangxin Cloud
    liujinxin@cxy-sc.com