Welcome to Chuangxin Cloud!
Chuangxin CloudUpload BOM Chuangxin CloudMy Account
Chuangxin Cloud Chuangxin Cloud
All Categories
    Language
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    42-3573-11

    42-3573-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 3,944 36.04
    RFQ
    		42-3573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3574-11

    42-3574-11

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 4,064 36.04
    RFQ
    		42-3574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3575-11

    42-3575-11

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,488 36.04
    RFQ
    		42-3575-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6571-11

    42-6571-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 4,248 36.04
    RFQ
    		42-6571-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6572-11

    42-6572-11

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 1,778 36.04
    RFQ
    		42-6572-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6574-11

    42-6574-11

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,144 36.04
    RFQ
    		42-6574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6575-11

    42-6575-11

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 1,389 36.04
    RFQ
    		42-6575-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6571-11

    44-6571-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 4,511 37.26
    RFQ
    		44-6571-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3570-11

    40-3570-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 2,738 33.33
    RFQ
    		40-3570-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3571-11

    40-3571-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 1,176 33.33
    RFQ
    		40-3571-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 4131 Record«Prev1... 350351352353354355356357...414Next»
    One-stop procurement solution
    One-stop procurement solution
    Cost down and save your time
    Cost down and save your time
    Reliable package and fast delivery
    Reliable package and fast delivery
    365 days after-sales service and warranty
    365 days after-sales service and warranty
    Chuangxin Cloud

    HOME

     Chuangxin Cloud

    PRODUCT

     Chuangxin Cloud

    E-mail

     Chuangxin Cloud

    USER
    Chuangxin Cloud
    liujinxin@cxy-sc.com