Welcome to Chuangxin Cloud!

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
30-6823-90C

30-6823-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,924 16.23
RFQ
30-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-3513-11H

26-3513-11H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

1,046 14.02
RFQ
26-3513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-3508-202

28-3508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,944 16.25
RFQ
28-3508-202

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-3508-302

28-3508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,585 16.25
RFQ
28-3508-302

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6508-202

28-6508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,092 16.25
RFQ
28-6508-202

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6508-302

28-6508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,704 16.25
RFQ
28-6508-302

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
68-PGM11032-10H

68-PGM11032-10H

CONN SOCKET PGA GOLD

Aries Electronics

3,246 16.25
RFQ
68-PGM11032-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-6556-10

32-6556-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,075 14.09
RFQ
32-6556-10

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
34-3503-20

34-3503-20

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

2,331 16.33
RFQ
34-3503-20

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-3503-30

34-3503-30

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

1,534 16.33
RFQ
34-3503-30

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
Total 4131 Record«Prev1... 240241242243244245246247...414Next»
One-stop procurement solution
One-stop procurement solution
Cost down and save your time
Cost down and save your time
Reliable package and fast delivery
Reliable package and fast delivery
365 days after-sales service and warranty
365 days after-sales service and warranty
Chuangxin Cloud

HOME

Chuangxin Cloud

PRODUCT

Chuangxin Cloud

E-mail

Chuangxin Cloud

USER