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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    16-1508-21

    16-1508-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,330 14.11
    RFQ
    		16-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    16-1508-31

    16-1508-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,685 14.11
    RFQ
    		16-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    38-6501-20

    38-6501-20

    CONN IC DIP SOCKET 38POS TIN

    Aries Electronics

    		 3,433 10.57
    RFQ
    		38-6501-20

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    31-0508-20

    31-0508-20

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    		 4,595 14.13
    RFQ
    		31-0508-20

    Datasheet

         		508 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    31-0508-30

    31-0508-30

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    		 1,352 14.13
    RFQ
    		31-0508-30

    Datasheet

         		508 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    24-0508-20

    24-0508-20

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 3,977 11.02
    RFQ
    		24-0508-20

    Datasheet

         		508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    24-0508-30

    24-0508-30

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 2,828 11.02
    RFQ
    		24-0508-30

    Datasheet

         		508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    24-1508-20

    24-1508-20

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 1,212 11.02
    RFQ
    		24-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    24-1508-30

    24-1508-30

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,574 11.02
    RFQ
    		24-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    08-3508-21

    08-3508-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 1,133 11.04
    RFQ
    		08-3508-21

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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