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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
40-6513-11

40-6513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,722 9.11
RFQ
40-6513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
37-0518-11H

37-0518-11H

CONN SOCKET SIP 37POS GOLD

Aries Electronics

2,010 10.40
RFQ
37-0518-11H

Datasheet

518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-810-90RWR

14-810-90RWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

4,146 10.40
RFQ
14-810-90RWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
28-3518-111

28-3518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,186 8.11
RFQ
28-3518-111

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-6518-111

28-6518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,763 8.11
RFQ
28-6518-111

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-0503-21

12-0503-21

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,865 10.42
RFQ
12-0503-21

Datasheet

0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
12-0503-31

12-0503-31

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3,707 10.42
RFQ
12-0503-31

Datasheet

0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
10-6511-11

10-6511-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,621 7.22
RFQ
10-6511-11

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
10-9513-11H

10-9513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,892 8.08
RFQ
10-9513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-6518-102

32-6518-102

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,600 8.08
RFQ
32-6518-102

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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