Welcome to Chuangxin Cloud!

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Aries Electronics
全部重置
应用所有
结果: 4131
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
06-6823-90C

06-6823-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

4,923 6.37
RFQ
06-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-1518-00

32-1518-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,027 7.84
RFQ
32-1518-00

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
32-6513-11

32-6513-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,844 7.89
RFQ
32-6513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-0503-31

09-0503-31

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3,579 7.87
RFQ
09-0503-31

Datasheet

0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
18-3518-111

18-3518-111

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,565 6.41
RFQ
18-3518-111

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-3518-102

20-3518-102

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,320 6.41
RFQ
20-3518-102

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
14-3518-01

14-3518-01

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,476 7.89
RFQ
14-3518-01

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
17-0508-20

17-0508-20

CONN SOCKET SIP 17POS GOLD

Aries Electronics

1,387 7.89
RFQ
17-0508-20

Datasheet

508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
17-0508-30

17-0508-30

CONN SOCKET SIP 17POS GOLD

Aries Electronics

1,508 7.89
RFQ
17-0508-30

Datasheet

508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
32-6518-10M

32-6518-10M

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,381 7.95
RFQ
32-6518-10M

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
Total 4131 Record«Prev1... 122123124125126127128129...414Next»
One-stop procurement solution
One-stop procurement solution
Cost down and save your time
Cost down and save your time
Reliable package and fast delivery
Reliable package and fast delivery
365 days after-sales service and warranty
365 days after-sales service and warranty
Chuangxin Cloud

HOME

Chuangxin Cloud

PRODUCT

Chuangxin Cloud

E-mail

Chuangxin Cloud

USER