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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Aries Electronics
全部重置
应用所有
结果: 4131
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
06-2503-31

06-2503-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

1,050 7.18
RFQ
06-2503-31

Datasheet

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
12-6503-20

12-6503-20

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,679 7.18
RFQ
12-6503-20

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-6503-30

12-6503-30

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,246 7.18
RFQ
12-6503-30

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-0517-90C

16-0517-90C

CONN SOCKET SIP 16POS GOLD

Aries Electronics

3,193 7.18
RFQ
16-0517-90C

Datasheet

0517 Bulk Active SIP 16 (1 x 16) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
13-0511-10

13-0511-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

1,034 7.20
RFQ
13-0511-10

Datasheet

511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-6518-10H

24-6518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,465 6.13
RFQ
24-6518-10H

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-822-90E

16-822-90E

16 PIN RT ANGLE HORIZONTAL SOCKT

Aries Electronics

3,448 7.25
RFQ

-

Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 105°C
07-0501-20

07-0501-20

CONN SOCKET SIP 7POS TIN

Aries Electronics

1,346 7.39
RFQ
07-0501-20

Datasheet

501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
07-0501-30

07-0501-30

CONN SOCKET SIP 7POS TIN

Aries Electronics

4,652 7.39
RFQ
07-0501-30

Datasheet

501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-810-90T

08-810-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

4,285 7.27
RFQ
08-810-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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