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RFI and EMI - Contacts, Fingerstock and Gaskets

制造商 Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
4912PA51H00100

4912PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,248 0.36
RFQ

-

51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 1.000" (25.40mm) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
67BCG2504303510R00

67BCG2504303510R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

2,429 0.39
RFQ
67BCG2504303510R00

Datasheet

BCG Bulk Active Fingerstock - 0.098" (2.50mm) 0.169" (4.30mm) 0.138" (3.50mm) Beryllium Copper Gold - Solder -
4157PA51H00100

4157PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,404 0.41
RFQ

-

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.787" (20.00mm) 1.000" (25.40mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
67BCG2003201508R00

67BCG2003201508R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

1,079 0.44
RFQ
67BCG2003201508R00

Datasheet

BCG Bulk Active Fingerstock - 0.078" (2.00mm) 0.126" (3.20mm) 0.059" (1.50mm) Beryllium Copper Gold - Solder -
67B5N4004005108R00

67B5N4004005108R00

SP,CON,TNR 5.10X4.00X4.00MM

Laird Technologies EMI

2,909 0.00
RFQ

-

- Cut Tape (CT) Active - - - - - - - - - -
4788PB51H00100

4788PB51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

4,460 0.46
RFQ
4788PB51H00100

Datasheet

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.250" (6.35mm) 1.000" (25.40mm) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
67SLG040040025PI00

67SLG040040025PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

4,472 0.00
RFQ
67SLG040040025PI00

Datasheet

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.157" (4.00mm) 0.098" (2.50mm) 0.157" (4.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
4084AA51K00100

4084AA51K00100

RFI FOF GASKET PU

Laird Technologies EMI

3,841 0.53
RFQ
4084AA51K00100

Datasheet

51K Bulk Active Fabric Over Foam Square 0.500" (12.70mm) 1.000" (25.40mm) 0.500" (12.70mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4692PA51G00200

4692PA51G00200

RFI FOF GASKET ADH

Laird Technologies EMI

3,252 0.53
RFQ
4692PA51G00200

Datasheet

51G Bulk Active Fabric Over Foam D-Shape 0.252" (6.40mm) 2.000" (50.80mm) 0.142" (3.60mm) - - - Adhesive -
67B7G2504005010R00

67B7G2504005010R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

3,735 0.53
RFQ
67B7G2504005010R00

Datasheet

- Bulk Active Fingerstock - 0.098" (2.50mm) 0.157" (4.00mm) 0.197" (5.00mm) Beryllium Copper Gold - Solder -
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