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RFI and EMI - Contacts, Fingerstock and Gaskets

制造商 Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
4206PA51G01800

4206PA51G01800

RFI FOF GASKET ADH

Laird Technologies EMI

187 10.31
RFQ
4206PA51G01800

Datasheet

51G Bulk Active Fabric Over Foam Square 0.394" (10.00mm) 18.000" (457.20mm) 0.394" (10.00mm) - - - Adhesive -
0077006102

0077006102

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

1,028 13.41
RFQ
0077006102

Datasheet

Variable Slot Mount Box Active Fingerstock - 0.320" (8.13mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper - - Slot 121°C
4131PA51H01800

4131PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

141 11.46
RFQ
4131PA51H01800

Datasheet

51H Bulk Active Fabric Over Foam Bell 0.500" (12.70mm) 18.000" (457.20mm) 0.142" (3.60mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
0077005702

0077005702

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

102 12.33
RFQ
0077005702

Datasheet

Variable Slot Mount Bag Active Fingerstock - 0.600" (15.24mm) 16.000" (406.40mm) 0.220" (5.59mm) Beryllium Copper - - Slot 121°C
BMI-C-002

BMI-C-002

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

6,387 1.85
RFQ
BMI-C-002

Datasheet

BMI-C Tape & Reel (TR) Active Fingerstock - 0.394" (10.00mm) 0.085" (2.17mm) 0.100" (2.54mm) Beryllium Copper Gold - Solder -
4223PA51G01800

4223PA51G01800

RFI FOF GASKET ADH

Laird Technologies EMI

177 5.60
RFQ
4223PA51G01800

Datasheet

51G Bulk Active Fabric Over Foam Rectangle 0.157" (4.00mm) 18.000" (457.20mm) 0.039" (1.00mm) - - - Adhesive -
LT18CJ1922

LT18CJ1922

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

500 3.52
RFQ
LT18CJ1922

Datasheet

LT18CJXXXX Bulk Active Fingerstock - 0.320" (8.13mm) 4.657" (118.28mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot -
67BCG2004705710R00

67BCG2004705710R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

3,445 0.87
RFQ
67BCG2004705710R00

Datasheet

BCG Bulk Active Fingerstock - 0.079" (2.00mm) 0.185" (4.70mm) 0.224" (5.70mm) Beryllium Copper Gold - Solder -
67B3G2507009010R0B

67B3G2507009010R0B

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

4,283 0.91
RFQ
67B3G2507009010R0B

Datasheet

B3G Tape & Reel (TR) Active Fingerstock - 0.098" (2.50mm) 0.276" (7.00mm) 0.354" (9.00mm) Beryllium Copper Gold - Solder -
67B5G2504506010R00

67B5G2504506010R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

3,817 0.94
RFQ
67B5G2504506010R00

Datasheet

B5G Bulk Active Fingerstock - 0.098" (2.50mm) 0.177" (4.50mm) 0.236" (6.00mm) Beryllium Copper Gold - Solder -
Total 1425 Record«Prev1... 678910111213...143Next»
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